Solder Paste AP-10 has been designed as a no clean, air or nitrogen reflowable solder paste. This formula has a wider process window and shows better activity on OSP boards than previous no clean formulations. AP-10 is a solder paste that maintains its activity and printing characteristics for up to 8 hours without shear thinning. AP-10 can tolerate printing pauses of up to 60 minutes with an effective first print down to 0.5 mm. The residues from AP-10 are light amber and clear from solder balls. AP-10 flux residues are light amber and washable with alcohols and/or commercial cleaners. Features: Lead Free Applications Very good wetting behaviour on most surfaces High printing speeds up to ...

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